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LTC3220/LTC3220-1
PACKAGE DESCRIPTION
PF Package
28-Lead UTQFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1759 Rev ?)
0.70 ± 0.05
2.64 ± 0.05
4.50 ± 0.05
2.40 REF
3.10 ± 0.05
2.64 ± 0.05
PACKAGE OUTLINE
0.20 ± 0.05
0.40 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
BOTTOM VIEW—EXPOSED PAD
PIN 1 NOTCH
R = 0.20 TYP
4.00 ± 0.10
0.55 ± 0.05
R = 0.05
TYP
R = 0.10
TYP
27 28
OR 0.25 × 45 °
CHAMFER
PIN 1
TOP MARK
(NOTE 6)
2.64 ± 0.10
0.40 ± 0.5
1
2
4.00 ± 0.10
2.40 REF
2.64 ± 0.10
(PF28) UTQFN 0907
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
0.127 REF
0.00 – 0.05
0.20 ± 0.05
0.40 BSC
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
32201fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
19
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